Directive 2011/65/EU - Amendment: Directive (EU) 2019/172, Annex III, exemption for lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
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Directive 2011/65/EU - Amendment: Directive (EU) 2019/172, Annex III, exemption for lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
